• One-stop ElectronicL Components Service Platform
  • 中文介绍
  • Contact Us  ▼

    • Brand Category

    Products

  • HOME > Products > Memory ICs > Multichip Packages

      • W71NW11GBADW

      Manufacturer No:W71NW11GBADW

      Manufacturer:Winbond

      Type:Multichip Packages

      Description:Multichip Packages 1G-bit 1.8V NAND + 256Mb LPDDR1 MCP x16/x16

      RFQ

    Specifications

    Product Attribute Attribute Value
    Manufacturer: Winbond
    Product Category: Multichip Packages
    RoHS:  Details
    Type: NAND Flash LPDDR1
    Memory Size: 1 Gbit 256 Mbit
    Series: W71NW11GB
    Mounting Style: SMD/SMT
    Brand: Winbond
    Data Bus Width: 16 bit
    Moisture Sensitive: Yes
    Organization: 64 M x 16 16 M x 16
    Product: NAND-Based MCP
    Product Type: Multichip Packages
    other: 2500
    Subcategory: Memory & Data Storage
    Supply Voltage - Max: 1.95 V
    Supply Voltage - Min: 1.7 V

    HOT

    • MT29VZZZBD9GULPR-046 W.214 TR
    Brand:Micron

    • MT30AZZZCDBZTPEQ-031 W.16D TR
    Brand:Micron

    • MT29C4G48MAZBBAKB-48 IT
    Brand:Micron

    • MT29GZ5A5BPGGA-53AIT.87J
    Brand:Micron

    • MT29AZ5A3CHHTB-18AAT.109
    Brand:Micron

    • W71NW11GC1DW
    Brand:Winbond

    • MT29GZ5A5BPGGA-53AIT.87J TR
    Brand:Micron

    • 04EM08-M4EM627-GA06
    Brand:Kingston

    • MT29AZ5A3CHHTB-18AIT.109 TR
    Brand:Micron

    • W25M02GWTCIG TR
    Brand:Winbond