W71NW10GE3FW

Manufacturer No:W71NW10GE3FW

Manufacturer:Winbond

Type:Multichip Packages

Description:Multichip Packages 1G-bit 1.8V NAND + 512Mb LPDDR2 MCP x8/x32

RFQ

Specifications

Product Attribute	Attribute Value
Manufacturer:	Winbond
Product Category:	Multichip Packages
RoHS:
Type:	NAND Flash LPDDR2
Memory Size:	1 Gbit 512 Mbit
Series:	W71NW10GE
Mounting Style:	SMD/SMT
Maximum Clock Frequency:	29 MHz 400 MHz
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 85 C
Brand:	Winbond
Data Bus Width:	8 bit 32 bit
Moisture Sensitive:	Yes
Organization:	128 M x 8 16 M x 32
Product:	NAND-Based MCP
Product Type:	Multichip Packages
other:	2000
Subcategory:	Memory & Data Storage
Supply Voltage - Max:	1.95 V
Supply Voltage - Min:	1.7 V