• One-stop ElectronicL Components Service Platform
  • 中文介绍
  • Contact Us  ▼

    • Brand Category

    Products

  • HOME > Products > Memory ICs > Multichip Packages

      • 08EP08-N3GTC32-GA67

      Manufacturer No:08EP08-N3GTC32-GA67

      Manufacturer:Kingston

      Type:Multichip Packages

      Description:Multichip Packages 8GB+8Gb 136 ball ePoP

      RFQ

    Specifications

    Product Attribute Attribute Value
    Manufacturer: Kingston
    Product Category: Multichip Packages
    RoHS:  Details
    Memory Size: 8 GB 8 Gbit
    Package / Case: FBGA-136
    Mounting Style: SMD/SMT
    Minimum Operating Temperature: - 25 C
    Maximum Operating Temperature: + 85 C
    Brand: Kingston
    Interface Type: eMMC 5.1
    Moisture Sensitive: Yes
    Packaging: Tray
    Product Type: Multichip Packages
    other: 152
    Subcategory: Memory & Data Storage
    Unit Weight: 0.005714 oz

    HOT

    • W71NW20GD3GW
    Brand:Winbond

    • W25M02GWZEIG
    Brand:Winbond

    • MT29GZ6A6BPIET-046AAT.112 TR
    Brand:Micron

    • W71NW11GBADW
    Brand:Winbond

    • S76HS512TC0BHB013
    Brand:Infineon Technologies

    • W25M02GVZEIGS
    Brand:Winbond

    • W25M02GVZEIT TR
    Brand:Winbond

    • 16EM16-M4CTB29-70H01
    Brand:Kingston

    • W25M02GWTCIT
    Brand:Winbond

    • MT30AZZZCD90TKXM-031 W.20T TR
    Brand:Micron