• One-stop ElectronicL Components Service Platform
  • 中文介绍
  • Contact Us  ▼
  • Brand Category

  • HOME > Products > Memory ICs > Multichip Packages
    • 08EP08-N3GTC32-GA67

      Manufacturer No:08EP08-N3GTC32-GA67

      Manufacturer:Kingston

      Type:Multichip Packages

      Description:Multichip Packages 8GB+8Gb 136 ball ePoP

      RFQ

    Specifications

    Product Attribute Attribute Value
    Manufacturer: Kingston
    Product Category: Multichip Packages
    RoHS:  Details
    Memory Size: 8 GB 8 Gbit
    Package / Case: FBGA-136
    Mounting Style: SMD/SMT
    Minimum Operating Temperature: - 25 C
    Maximum Operating Temperature: + 85 C
    Brand: Kingston
    Interface Type: eMMC 5.1
    Moisture Sensitive: Yes
    Packaging: Tray
    Product Type: Multichip Packages
    other: 152
    Subcategory: Memory & Data Storage
    Unit Weight: 0.005714 oz

    HOT

  • W25M512JWCIQ TR
    Brand:Winbond

  • MT29VZZZCDA1SKPR-046 W.181 TR
    Brand:Micron

  • MT30AZZZCDBZTPEQ-031 W.16D
    Brand:Micron

  • MT29AZ5A3CHHTB-18AIT.109
    Brand:Micron

  • W25M512JVCIM
    Brand:Winbond

  • MT30AZZZCD90TKXM-031 W.20T TR
    Brand:Micron

  • W71NW21GD1DW
    Brand:Winbond

  • 04EM04-N3GM627-GA06U
    Brand:Kingston

  • W25M02GVTCIT
    Brand:Winbond

  • MT29GZ5A3BPGGA-53AIT.87K TR
    Brand:Micron