Manufacturer No:08EP08-N3GTC32-GA67
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 8GB+8Gb 136 ball ePoP
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Product Attribute | Attribute Value |
---|---|
Manufacturer: | Kingston |
Product Category: | Multichip Packages |
RoHS: | Details |
Memory Size: | 8 GB 8 Gbit |
Package / Case: | FBGA-136 |
Mounting Style: | SMD/SMT |
Minimum Operating Temperature: | - 25 C |
Maximum Operating Temperature: | + 85 C |
Brand: | Kingston |
Interface Type: | eMMC 5.1 |
Moisture Sensitive: | Yes |
Packaging: | Tray |
Product Type: | Multichip Packages |
other: | 152 |
Subcategory: | Memory & Data Storage |
Unit Weight: | 0.005714 oz |
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Brand:Winbond
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Brand:Winbond
MT29GZ5A5BPGGA-046AAT.87J
Brand:Micron
W25M02GVTCIT
Brand:Winbond
MT29VZZZBD9GULPR-046 W.214 TR
Brand:Micron
MT29GZ5A5BPGGA-53AIT.87J
Brand:Micron
MT29GZ5A5BPGGA-53AAT.87J
Brand:Micron
W25M161AVEIT
Brand:Winbond
W71NW10GE3FW
Brand:Winbond
MT29VZZZCD91SKSM-046 W.17Y
Brand:Micron
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