Manufacturer No:04EM04-N3GM627-GA06U
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 4GB+4Gb221 ball FBGA
RFQ

CLOSE
| Product Attribute | Attribute Value |
|---|---|
| Manufacturer: | Kingston |
| Product Category: | Multichip Packages |
| RoHS: | Details |
| Memory Size: | 4 GB 4 Gbit |
| Package / Case: | FBGA-221 |
| Mounting Style: | SMD/SMT |
| Minimum Operating Temperature: | - 25 C |
| Maximum Operating Temperature: | + 85 C |
| Brand: | Kingston |
| Interface Type: | eMMC 5.0 |
| Moisture Sensitive: | Yes |
| Packaging: | Tray |
| Product Type: | Multichip Packages |
| other: | 152 |
| Subcategory: | Memory & Data Storage |
| Unit Weight: | 0.011393 oz |
HOTW25M02GVTBIT TR
Brand:Winbond
MT29GZ5A5BPGGA-53IT.87J
Brand:Micron
W25M02GVTCIT
Brand:Winbond

08EP08-N3GTC32-GA67
Brand:Kingston
MT30AZZZBD90TKXM-031 W.197
Brand:Micron
MT30AZZZDDA0TPQS-031 W.19Q
Brand:Micron
MT29GZ6A6BPIET-53IT.112
Brand:Micron

MT29C4G48MAZBBAKS-48 IT TR
Brand:Micron
W25M512JWCIM
Brand:Winbond
S71KL512SC0BHV000
Brand:Infineon Technologies
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com






