Manufacturer No:04EM04-N3GM627-GA06U
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 4GB+4Gb221 ball FBGA
RFQ

CLOSE
| Product Attribute | Attribute Value |
|---|---|
| Manufacturer: | Kingston |
| Product Category: | Multichip Packages |
| RoHS: | Details |
| Memory Size: | 4 GB 4 Gbit |
| Package / Case: | FBGA-221 |
| Mounting Style: | SMD/SMT |
| Minimum Operating Temperature: | - 25 C |
| Maximum Operating Temperature: | + 85 C |
| Brand: | Kingston |
| Interface Type: | eMMC 5.0 |
| Moisture Sensitive: | Yes |
| Packaging: | Tray |
| Product Type: | Multichip Packages |
| other: | 152 |
| Subcategory: | Memory & Data Storage |
| Unit Weight: | 0.011393 oz |
HOTS71KL512SC0BHV000
Brand:Infineon Technologies
W25M02GWTCIT
Brand:Winbond
W25M02GWTCIT TR
Brand:Winbond
MT29VZZZ7D8GUFSL-046 W.218
Brand:Micron

W25M02GWZEIG
Brand:Winbond
S78HL512TC0BHB003
Brand:Infineon Technologies
MT30AZZZDDB0TPWL-031 W.19R
Brand:Micron
MT29GZ5A3BPGGA-046IT.87K TR
Brand:Micron

W71NW11GC1DW
Brand:Winbond

W25M02GVZEIT TR
Brand:Winbond
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com






