DILB32P-223TLF

Manufacturer No:DILB32P-223TLF

Manufacturer:Amphenol

Type:IC & Component Sockets

Description:IC & Component Sockets SOCKETS DIP

RFQ

Specifications

Product Attribute	Attribute Value
Manufacturer:	Amphenol
Product Category:	IC & Component Sockets
RoHS:
Product:	DIP / SIP Sockets
Number of Positions:	32 Position
Number of Rows:	2 Row
Type:	Open Frame
Pitch:	2.54 mm
Termination Style:	Solder Pin
Contact Plating:	Tin
Row Spacing:	15.24 mm
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Tube
Brand:	Amphenol FCI
Contact Material:	Copper Alloy
Features:	Standard
Mounting Style:	Through Hole
Product Type:	IC & Component Sockets
other:	15
Subcategory:	IC & Component Sockets
Unit Weight:	0.183766 oz